20 of China's OSATs push into advanced packaging amid EUV curbs

DIGITIMESSeptember 17, 2026en

China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's largest outsourced semiconductor assembly and test (OSAT) suppliers to specialist packaging houses and chiplet startups, increasingly targeting AI and high-performance computing (HPC).

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