Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

DIGITIMESOctober 10, 2026en

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years, according to Nur Hilwani, Technology & Market Analyst, Semiconductor Equipment at France-based Yole Group. Talent, IP ownership and supply-chain gaps remain hurdles.

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