Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials

DIGITIMESAugust 24, 2026en

As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.

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