不只做鞋膠！南寶挾一甲子功力華麗轉型，強攻半導體與 AI 封裝材料

TechNews (TW)August 29, 2026zh-TW

南寶用一甲子時間，不斷累積創新高分子材料技術，挾 3 年賺兩股本的傲人成績，要在半導體先進封裝、AI 銅箔基板 […]

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