直擊 AI 運算挑戰，工研院突破性高效能電力轉換與微流體散熱技術亮相
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針對未來 AI 大語言模型帶來的龐大運算需求，工研院在 2026 台日半導體科技論壇中發表了最新的異質整合封裝 […]
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