AI 晶片趨向大面積化，英特爾強調 EMIB 封裝技術將迎接龐大商機挑戰台積電
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隨著人工智慧（AI）晶片尺寸持續擴大，英特爾（Intel）旗下先進封裝技術「EMIB（嵌入式多晶片互連橋接）」 […]
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