AI packaging demand exposes supply-chain gaps for Taiwan materials makers

DIGITIMESAugust 24, 2026en

AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned that capacity for the next three years is already largely booked, underscoring pressure on Taiwan's materials makers to accelerate R&D and local production.

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