AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

DIGITIMESSeptember 11, 2026en

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical validation and supply-chain development. Key challenges include material brittleness and inconsistencies in through-glass via (TGV) metallisation processing and reliability.

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