迎戰萬針級 AI 晶片測試!景美 SEMICON 秀 40 微米極限微鑽孔技術

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迎戰萬針級 AI 晶片測試!景美 SEMICON 秀 40 微米極限微鑽孔技術

景美科技今年參與 SEMICON Taiwan 2026 國際半導體展,展示「上下導板細微鑽孔、探針卡結構組件 […]

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