AI substrate bottleneck shifts from design to manufacturing

DIGITIMESOctober 20, 2026en

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As substrate sizes, layer counts, I/O and power requirements rise, the industry's key bottleneck is shifting from design capabilities to manufacturing capacity.

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