AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck

DIGITIMESOctober 13, 2026en

As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention has shifted from upstream T-glass cloth used in copper-clad laminates (CCL) to the advanced manufacturing equipment required to expand IC substrate capacity.

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