日月光揭示 AI 先進封裝藍圖，VIPack、面板級封裝與矽光子成突圍關鍵
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在 2026 台日半導體科技論壇中，日月光半導體前瞻工程開發處資深處長黃敏龍發表「AI 趨勢下的先進封裝發展與 […]
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