BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead

DIGITIMESOctober 16, 2026en

Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core substrates, producing 24-layer samples measuring more than 100 × 100mm. The samples have been delivered to customers and passed multiple reliability tests, with further validation underway.

This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.