Broadcom executive says chipmakers must tackle packaging, power limits together

DIGITIMESOctober 14, 2026en

Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that die size, packaging, power delivery, and cooling are becoming major constraints as workloads evolve, making faster coordination essential for future system performance.

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