China elevates HBM and HBF in five-year plan, opening a new front in AI memory
DIGITIMESen

China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. For the first time, the plan identifies high-bandwidth flash memory and high-bandwidth memory as priority areas for next-generation memory research.
This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.
Read the full story at DIGITIMES- Forskning
Related AI news
- Google Cloud opens Singapore engineering centerTech in Asia · September 15, 2026
- Global semiconductor revenue hits record US$425B in 2Q26DIGITIMES · September 15, 2026
- US FCC, White House tighten controls on power systems, raising the trust bar for Taiwanese suppliersDIGITIMES · September 15, 2026
- Microsoft commits to sweeping AI privacy rules for students. Will other tech giants follow?Economic Times Tech · September 15, 2026
- Vibe Patenting: Evaluating LLM Judges for Professional Patent-Drafting AgentsarXiv cs.AI · September 15, 2026
- Cost Characterization of Vertically Partitioned Federated Knowledge GraphsarXiv cs.AI · September 15, 2026