China makes progress in 3-nm chips without advanced lithography tools
SCMP Techen

Chinese researchers have made early strides in pushing semiconductor processing nodes below 3-nm using older lithography technology, as more advanced extreme ultraviolet lithography (EUV) tools from ASML remain blocked under US sanctions. The breakthrough marks the latest progress in China’s drive to chart an alternative path to advanced chipmaking amid US export restrictions. Under current export control rules, Dutch equipment giant ASML is barred from selling its state-of-the-art EUV machines...
This is a short summary published by AI Global Wire. The full article is owned and hosted by SCMP Tech — open it there to read it in full.
Read the full story at SCMP Tech- Verktyg
- Forskning
Related AI news
- Data center builder Nscale files for IPO after multibillion-dollar Anthropic dealSiliconANGLE · September 19, 2026
- Google is the latest AI lab with a security testing mishapAxios · September 19, 2026
- Meta's personal AI agent Muse climbs to No. 1 among free apps on Apple's US App Store, ahead of ChatGPT; Muse launched on September 8 (Georgia Hennessy/Business Insider)Techmeme · September 18, 2026
- Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI ordersDIGITIMES · September 18, 2026
- Anthropic is operating a lab that conducts biology experimentsTechCrunch AI · September 18, 2026
- AI hallucination nearly triggers US military operationTechCrunch AI · September 18, 2026