China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

DIGITIMESSeptember 3, 2026en

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser integration of multiple dies and high-bandwidth memory for AI chips and high-performance computing (HPC).

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