China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems

DIGITIMESOctober 14, 2026en

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D packaging for greater power efficiency, optical interconnects for faster data transmission, and open software ecosystems for easier adoption—will determine whether Chinese GPUs can advance from standalone accelerators to large-scale AI computing clusters.

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