China's JCET seeks US$968M for AI-driven packaging expansion

DIGITIMESSeptember 6, 2026en

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China's domestic semiconductor supply chain.

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