China’s storage makers aim to climb value chain with advanced packaging bets

SCMP TechSeptember 23, 2026en

Chinese storage makers, long known for packaging chips into modules, have been moving up the value chain into wafer-level operations, with the latest firm to make the jump investing 4.5 billion yuan (US$672 million) in an advanced packaging project. The sum, which Shanghai-listed Biwin Storage Technology will pour into the third phase of its advanced packaging and testing project in Dongguan, in southern China’s Guangdong province, will exceed the 3.09 billion yuan it put into the first two...

This is a short summary published by AI Global Wire. The full article is owned and hosted by SCMP Tech — open it there to read it in full.