Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission

DIGITIMESSeptember 7, 2026en

As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged as critical bottlenecks for AI infrastructure. Corning is expanding the deployment of advanced glass solutions across packaging, glass substrates, and optical communications, while partnering with ecosystem players to qualify next-generation glass substrates and through-glass via (TGV) technologies.

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