CPO gains momentum as AI interconnect demands outpace chip gains

DIGITIMESAugust 21, 2026en

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026 in Taipei, analyst Jerry Zheng said the technology is moving toward mainstream adoption as bandwidth demand outpaces computing gains.

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