CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

DIGITIMESSeptember 10, 2026en

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly remained around 25%, highlighting the difficulty of translating its progress in conventional DRAM into high-performance AI memory.

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