Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination

DIGITIMESAugust 14, 2026en

Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company said it is now developing equipment for chip-in-package, glass substrates, and organic interposers, while also moving from panel lamination into wafer lamination, primarily targeting "Taiwan's largest semiconductor manufacturer."

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