Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

DIGITIMESAugust 7, 2026en

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026. Some customers have recently received notices of varying adjustments from the Singapore-based subsidiary of China's JCET.

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