FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

DIGITIMESSeptember 18, 2026en

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization and visibility extending through 2027. Optical communications products began shipping in small volumes in 2026 and are expected to scale further in 2027 and 2028, though adoption will ultimately follow customers. "We cannot run faster than our customers," Lu said.

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