Foxconn links FII and FIT to tackle AI infrastructure beyond the chip

DIGITIMESSeptember 17, 2026en

Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration — to move beyond standalone product supply toward system-level solutions across AI servers, high-speed interconnects, optical communications, power and cooling.

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