Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

DIGITIMESSeptember 16, 2026en

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias are making conventional filling methods harder to use. Geckos is promoting a copper paste process with vacuum printing as an alternative that could improve yield, lower costs, and support denser interconnects.

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