Glass substrates, TGV set to reshape 2027 advanced packaging race

DIGITIMESSeptember 16, 2026en

As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive focus for supply chains in the US, Japan, South Korea, Taiwan, and China. Players are now positioning themselves around four key steps — glass materials, via drilling, via metallization, and multilayer substrate lamination — to capture opportunities for 2027 and 2028.

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