Google, MediaTek embrace advanced packaging diversification

DIGITIMESAugust 27, 2026en

Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to adopt the packaging technology. The shift is fueling expectations that more advanced packaging orders could move to Intel, while TSMC's chip-on-wafer-on-substrate (CoWoS) remains tight on capacity.

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