Gudeng sees double-digit advanced packaging growth from 2027

DIGITIMESAugust 31, 2026en

Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity expansion. Gudeng chairman Bill Chiu said on August 31, 2026, that the company's advanced packaging business is expected to post double-digit revenue growth from 2027 as global demand continues to expand.

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