馬來西亞 HBM 出貨量激增，直指英特爾先進封裝分食台積電 CoWoS 霸主地位

TechNews (TW)August 18, 2026zh-TW

根據韓國最新的晶片出口數據與產業分析顯示，全球半導體先進封裝市場正迎來一波重大版圖位移。韓國向馬來西亞出口的高 […]

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