High-speed optical communications drive demand for mSAP competition among Taiwan PCB makers

DIGITIMESNovember 4, 2026en

As AI computing clusters continue to expand, data centers are demanding higher transmission speeds and greater bandwidth. To overcome the manufacturing bottlenecks of traditional high-density interconnect (HDI) technology, modified semi-additive processes (mSAP) are rapidly emerging as the new market mainstream for optical communications modules and high-end server PCBs.

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