Huawei plans to launch the Ascend 960DT AI chip in Q1 2027 and the 960PR in Q3 2027, and says its UnifiedBus tech is key to its next-generation large AI systems (Reuters)
Techmemeen

Reuters : Huawei plans to launch the Ascend 960DT AI chip in Q1 2027 and the 960PR in Q3 2027, and says its UnifiedBus tech is key to its next-generation large AI systems — Huawei Technologies (HWT.UL) will launch two new artificial-intelligence semiconductors in 2027, rotating chairman David Wang said on Thursday …
This is a short summary published by AI Global Wire. The full article is owned and hosted by Techmeme — open it there to read it in full.
Read the full story at TechmemeRelated AI news
- 偉訓 AI 布局逐步發酵,多元業務帶動營運升溫TechNews (TW) · September 17, 2026
- 2050 年電子廢棄物恐破 2 億噸,AI 貢獻占兩成TechNews (TW) · September 17, 2026
- 喊話降速容易落地難,Anthropic 與 OpenAI「外部駐點審查」引爆內部反彈TechNews (TW) · September 17, 2026
- A look at the rapid integration of AI into warfare, as the greater speed and scale of AI-assisted target generation processes increase the risk of errors (Financial Times)Techmeme · September 17, 2026
- Google Home: KI-Agenten wie Claude dürfen jetzt das Smart Home steuernheise online – KI · September 17, 2026
- Huawei quickens AI chip pace, promises next entrant 3 quarters earlySCMP Tech · September 17, 2026