Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027

DIGITIMESOctober 14, 2026en

Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on smaller process nodes. Its next-generation Kirin chip, scheduled for 2027, has entered testing, with initial results meeting expectations.

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