Indium CEO: packaging, cooling and power are next AI bottlenecks

DIGITIMESSeptember 2, 2026en

As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and power delivery. With GPUs, high-bandwidth memory (HBM), and advanced packaging pushing power density higher, chipmakers now face challenges that extend well beyond silicon manufacturing, including managing thermal expansion, warpage, heat dissipation, and reliability across heterogeneously integrated materials.

This is a short summary published by AI Global Wire. The full article is owned and hosted by DIGITIMES — open it there to read it in full.