Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware

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Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware

In the era of AI and high-performance computing (HPC), the once-separate worlds of chip design, packaging, and circuit boards are converging. According to the Global Electronics Association, AI server motherboards have become the largest, thickest, and most structurally complex PCBs ever manufactured, drawing substrate and PCB makers, which historically reacted to decisions made by chipmakers and packaging clients, into the heart of AI hardware development.

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