Kinsus explores AlN ceramics beyond glass for AI advanced packaging

DIGITIMESOctober 28, 2026en

Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass amid ongoing brittleness and reliability challenges, according to R&D vice president Ting-hao Lin at the 2026 TPCA Show.

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