Manz Asia says yield is key to glass core mass production

DIGITIMESAugust 22, 2026en

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.

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