MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

DIGITIMESSeptember 16, 2026en

MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging technology. In media interviews ahead of the launch, MediaTek acknowledged that the Dimensity 9600 Pro skips the latest wafer-level multi-chip module (WMCM) technology used by rivals, opting instead to retain its existing high-bandwidth package-on-package (HBPoP) solution.

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