MediaTek pushes advanced packaging and supply chain to keep pace with AI

DIGITIMESSeptember 2, 2026en

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after excluding memory, 75% of the cost comes from advanced packaging, assembly and testing. In the single-chip era, that portion barely existed in the cost structure.

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