Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge

DIGITIMESSeptember 4, 2026en

Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.

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