MLCC 龍頭村田攻 AI 晶片垂直供電，iPaS 明年量產
TechNews (TW)zh-TW
為減少電力傳輸的損耗，電源也開始從晶片周圍往「正下方」移動。全球積層陶瓷電容（MLCC）龍頭村田製作所計劃明年 […]
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