台積電矽谷 OIP 論壇召開，串聯矽光子與 3D 先進封裝技術以突破 AI 晶片極限

TechNews (TW)September 7, 2026zh-TW

隨著人工智慧（AI）硬體需求持續發酵，全球半導體代工龍頭台積電於矽谷舉辦了年度「開放創新平台（OIP）論壇」。 […]

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