Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain

DIGITIMESOctober 21, 2026en

Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board integration becomes a growing technical bottleneck, industry executives said at IMPACT 2026 in Taipei.

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