QuantumDiamonds targets HBM defects as it develops inline inspection tool

DIGITIMESNovember 5, 2026en

German quantum-sensing startup QuantumDiamonds has tested its technology on high-bandwidth memory (HBM) devices, including cases involving individual through-silicon via (TSV) failures, as it works to bring its chip defect detection technology into semiconductor production lines. The company, however, does not yet have a high-throughput wafer inspection system.

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