Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

DIGITIMESSeptember 16, 2026en

Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser, and higher-performing, bolstering the value of the advanced packaging end of the chip process.

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