Samsung Electro-Mechanics commits $5 billion to AI chip substrates; record bet hits upstream wall
Korea & Taiwan AI Markets (Google News)en
Korea & Taiwan AI Markets (Google News)
AI Global WireFC-BGA substrate maker Samsung Electro-Mechanics (SEMCO) approved a record $4.99 billion investment to expand AI chip packaging capacity at its Sejong, South Korea plant and Vietnamese subsidiary -- ...
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