Samsung Electro-Mechanics, LG Innotek vie in AI package substrates

DIGITIMESSeptember 11, 2026en

At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.

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