Samsung Electro-Mechanics takes glass substrates to SEMICON Taiwan
DIGITIMESen
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first appearance at SEMICON Taiwan 2026, with advanced packaging and glass substrate expert Gang Duan traveling to Taiwan to unveil the company's roadmap for next-generation advanced packaging substrates aimed at AI infrastructure.
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